LTE · 5G · 6G Comms
- Base Station·Antenna
- DAS·Repeater
- mmWave·CPE
- PA·RF Module
A low-loss, high-frequency laminate with a Dk of approximately 3.40 and a Df of approximately 0.0023. It is suitable for next-generation wireless applications where low dielectric loss at high frequencies is critical, including mmWave CPE and PA/RF modules.
| Property | Value | Unit | Test Method |
|---|---|---|---|
| Dielectric Constant (@ 10 GHz) | 3.32 ± 0.05 | — | IPC-TM-650 2.5.5.5 (Measured-Based Estimate) |
| Dissipation Factor (@ 10 GHz) | 0.002 | — | IPC-TM-650 2.5.5.5 (Measured-Based Estimate) |
| Dielectric Constant (@ 10 GHz) | 3.4 ± 0.05 | — | IPC-TM-650 2.5.5.13 |
| Dissipation Factor (@ 10 GHz) | 0.0023 | — | IPC-TM-650 2.5.5.13 |
| Volume Resistivity | 9.7 x 10⁹ | MΩ·cm | ASTM D257 |
| Surface Resistivity | 1.4 x 10¹⁰ | MΩ | ASTM D257 |
| Dielectric Breakdown Voltage | 35 | kV | ASTM D149 |
| Tensile Modulus (MD/TD) | 15,300 / 14,700 | MPa | ASTM D882 |
| Tensile Strength (MD/TD) | 166 / 154 | MPa | ASTM D882 |
| Flexural Strength | 400 | MPa | ASTM D790 |
| Coefficient of Thermal Expansion (X/Y/Z) | 18 / 43 | ppm/°C | ASTM E831 |
| Tg (DMA) | 200 | °C | ASTM D7028 |
| Td (TGA) | 430 | °C | ASTM D3850 |
| Thermal Conductivity | 0.42 | W/(m·K) | ASTM E1461 |
| Moisture Absorption | 0.09 | % | ASTM D570 |
| Density | 1.64 | g/cm³ | ASTM D792 |
| Copper Peel Strength | 0.85 | N/mm | ASTM D3330 |
| Flammability | V-0 | — | UL94 |