Low-Dielectric CCL NURI-Series

NURI-9647L

Designed to reduce signal loss in next-generation wireless systems High-Frequency, Low-Loss Laminate

Applications

LTE · 5G · 6G Comms

  • Base Station·Antenna
  • DAS·Repeater
  • mmWave·CPE
  • PA·RF Module

Defense · Aerospace

  • Radar
  • Satellite Communications·Satcom
  • X/Ku/Ka-band RF

Automotive Electronics

  • Automotive Radar·Sensor
  • Automotive RF Module
  • Camera·MCU

Optical Comms · Network

  • Optical Transmission Equipment

AI · Semiconductor

  • AI·Memory Tester
  • SoC·High-Heat PCB

High-Power RF

  • HPA·SSPA
  • Particle Accelerator RF
  • Wireless Power Transmission (WPT)
  • Industrial Antenna

Product Description

A low-loss, high-frequency laminate with a Dk of approximately 3.40 and a Df of approximately 0.0023. It is suitable for next-generation wireless applications where low dielectric loss at high frequencies is critical, including mmWave CPE and PA/RF modules.

Product Properties

Property Value Unit Test Method
Dielectric Constant (@ 10 GHz) 3.32 ± 0.05 — IPC-TM-650 2.5.5.5 (Measured-Based Estimate)
Dissipation Factor (@ 10 GHz) 0.002 — IPC-TM-650 2.5.5.5 (Measured-Based Estimate)
Dielectric Constant (@ 10 GHz) 3.4 ± 0.05 — IPC-TM-650 2.5.5.13
Dissipation Factor (@ 10 GHz) 0.0023 — IPC-TM-650 2.5.5.13
Volume Resistivity 9.7 x 10⁹ MΩ·cm ASTM D257
Surface Resistivity 1.4 x 10¹⁰ MΩ ASTM D257
Dielectric Breakdown Voltage 35 kV ASTM D149
Tensile Modulus (MD/TD) 15,300 / 14,700 MPa ASTM D882
Tensile Strength (MD/TD) 166 / 154 MPa ASTM D882
Flexural Strength 400 MPa ASTM D790
Coefficient of Thermal Expansion (X/Y/Z) 18 / 43 ppm/°C ASTM E831
Tg (DMA) 200 °C ASTM D7028
Td (TGA) 430 °C ASTM D3850
Thermal Conductivity 0.42 W/(m·K) ASTM E1461
Moisture Absorption 0.09 % ASTM D570
Density 1.64 g/cm³ ASTM D792
Copper Peel Strength 0.85 N/mm ASTM D3330
Flammability V-0 — UL94