BN Filler

High-content boron nitride fillers available in agglomerated, spherical, and platelet morphologies

provide optimized thermal management solutions for TIMs, thermally conductive CCLs, automotive electronics, and battery applications.

Product Lineup

Product Morphology Key Features Recommended Applications
WABN Series Agglomerated BN Thermal pathway formation / Improved dispersion TIM, CCL, Thermally Conductive Resin
WSBN Series Spherical BN High loading / Isotropic thermal conduction TIM, Encapsulant, Thermally Conductive Resin
WFBN Series Platelet BN High intrinsic thermal conductivity CCL, Battery, Engineering Plastics

Product Features & Specifications

WABN agglomerated boron nitride particles

WABN Series

  • Agglomerated structure formed from platelet BN
  • Forms thermal pathways between BN particles
  • Improves heat transfer in both in-plane and through-plane directions
  • Proprietary surface treatment improves resin compatibility
  • Suitable for highly filled composites
Particle Size
100–200 μm
Tap Density
0.9–1.2 g/cm³
Morphology
Agglomerated

Applications

Thermal Materials

  • Thermal Pads
  • Thermal Grease
  • Gap Fillers
  • Potting / Encapsulant

Electronics

  • Thermally Conductive CCL
  • Power Electronics
  • LED / Power Modules
  • Semiconductor Thermal Management

Automotive / EV

  • Battery Pack
  • Battery Module
  • Motor / Inverter
  • OBC (On-Board Charger)

Communications

  • 5G / 6G RF Equipment
  • Base Stations
  • High-Power RF Modules