LTE · 5G · 6G Comms
- Base Station·Antenna
- DAS·Repeater
- mmWave·CPE
- PA·RF Module
MARU-9610L
Engineered for efficient thermal management in high-power applications
High Thermal Conductivity, Low-Dk Laminate
Applications
Defense · Aerospace
- Radar
- Satellite Communications·Satcom
- X/Ku/Ka-band RF
Automotive Electronics
- Automotive Radar·Sensor
- Automotive RF Module
- Camera·MCU
Optical Comms · Network
- Optical Transmission Equipment
AI · Semiconductor
- AI·Memory Tester
- SoC·High-Heat PCB
High-Power RF
- HPA·SSPA
- Particle Accelerator RF
- Wireless Power Transmission (WPT)
- Industrial Antenna
Product Description
A low-Dk laminate combining a thermal conductivity of 2.5 W/m·K with low-loss RF performance. It is suitable for high-power-density applications requiring efficient heat spreading, including SSPA/HPA, RF systems for particle accelerators, high-power RF modules, and thermally demanding SoC boards.
Product Properties
| Property | Value | Unit | Test Method |
|---|---|---|---|
| Dielectric Constant (@ 10 GHz) | 3.5 | — | IPC-TM-650 2.5.5.5 (Measured-Based Estimate) |
| Dissipation Factor (@ 10 GHz) | 0.002 | — | IPC-TM-650 2.5.5.5 (Measured-Based Estimate) |
| Tg (DMA) | 200 | °C | ASTM D7028 |
| Td (TGA) | 430 | °C | ASTM D3850 |
| Thermal Conductivity | 2.5 | W/(m·K) | ASTM E1461 |
| Flammability | ND | — | UL94 |